Samsung confirms next generation HBM4 memory is in fact Snowbolt — and reveals it plans to flood the market with precious AI memory amidst growing competition with SK Hynix and Micron

Samsung has revealed it expects to triple its HBM chip production this year.

“Following the third-generation HBM2E and fourth-generation HBM3, which are already in mass production, we plan to produce the 12-layer fifth-generation HBM and 32 gigabit-based 128 GB DDR5 products in large quantities in the first half of the year,” SangJoon Hwang, EVP and Head of DRAM Product and Technology Team at Samsung said during a speech at Memcon 2024.

You may also like

Related Posts

Leave a Reply

Your email address will not be published. Required fields are marked *